Bexora
Bexora
Discover our highly configurable servers and components built for enterprise virtualization and hyperconverged infrastructure.
Established in 2016, Bexora AI Systems (China) Co., Ltd. has developed into a premier B2B manufacturer specializing in high-density computing infrastructure. Spanning an engineered facility of 18,600㎡, we specialize in configurable hardware topologies, hyperconverged modular nodes, and advanced cooling technologies that empower AI research hubs, enterprise data systems, and cloud providers globally.
By using disaggregated design principles, we assist datacenters in decoupling CPU compute sleds, high-capacity storage drives, and PCIe acceleration blocks. This approach significantly lowers the total cost of ownership (TCO) and extends the functional lifecycle of hardware assets.
Why global enterprises rely on Chinese hubs to engineer complex high-performance compute architectures.
Our proximity to dynamic tech hubs like Shenzhen and Yangtze River Delta provides direct, latency-free access to raw sheet metals, custom heat pipes, power supplies, and high-frequency connectors. By collaborating with 860 partners, we dramatically shorten lead times compared to Western assembly plants.
Our 160-engineer team manages the entire customization pipeline, including board routing layout optimization, BIOS tuning, thermal simulations, and mechanical modeling. We rapidly deliver bespoke chassis heights, non-standard card interfaces, and custom IPMI systems to match your operations.
We perform 100% full-system diagnostic inspections. By coupling automated optical inspection (AOI) with burn-in rooms and thermal stress chambers, our 45-person QC team verifies that each system functions flawlessly under intensive computational workloads.
Modern data networks face variable workloads. Standard monolithic servers often lead to either underutilized hardware or processing bottlenecks. Our modular system designs solve this by isolating physical assets into discrete, swappable components.
Hot-swappable sleds featuring the latest Intel Xeon Scalable or AMD EPYC processors. Perform compute maintenance without interrupting storage or interface routing.
Directly map dense PCIe acceleration blocks (NVIDIA H100/H800/L40S or local AI accelerators) to any node on the fabric using high-speed PCIe switch boards.
Easily scale storage capacity using SAS, SATA, and NVMe U.2/U.3 interfaces, and manage RAID arrays via smart compatible array cards.
Redundant 80-Plus Titanium power supplies feed a common copper busbar, simplifying the power path and improving energy efficiency.
We follow a strict, dual-stage QA framework to guarantee zero-day hardware failures upon site delivery:
Configuring modular systems to meet the unique challenges of modern data environments.
Optimize datacenter efficiency by integrating modular compute nodes that feature individual backplane fabrics. This helps cloud service providers reduce hardware waste, optimize local power use, and support high user density.
For research labs training LLMs, our modular servers handle high power loads and deliver the thermal efficiency needed for dense, continuous GPU operations without throttling.
Deploy ruggedized, short-depth modular server chassis inside regional telecommunication substations or industrial facilities to process IoT and AI data locally near the user.
A visual walkthrough of Bexora's advanced manufacturing capabilities, SMT assembly lines, and system inspection operations.
Deep dive into custom configuration options, manufacturing capabilities, and global procurement logistics.
We perform complete firmware and hardware verification tests on our modular systems. Our 160 R&D engineers design and test our PCIe backplanes, drive backplanes, and BMC modules to make sure they integrate smoothly with processors, DIMMs, and expansions from major brands like Intel, AMD, and NVIDIA.
We offer customization at every level, including custom rack configurations, specialized PCIe expansion risers, custom BIOS/BMC splash screens and IP addresses, liquid cooling manifold configurations, and bespoke sheet metal modifications. We design systems to match your cooling profiles and power limits.
We use a mix of thermal modeling, smart fan controllers, and options for liquid cooling cold plates. This allows us to maintain peak system performance, even when deploying 400W+ processors and high-wattage GPUs in dense compute environments.
Every module undergoes an initial Automated Optical Inspection (AOI), followed by system assembly, memory diagnostic checks, and a 24-to-72 hour burn-in stress test at high temperatures. Our 45-person QC team verifies all system ports and hardware lanes before packaging.
Standard configurations typically ship within 2 to 3 weeks, thanks to our established parts inventory and supply chain partners. Custom OEM/ODM runs that require unique tooling or chassis designs generally ship in 6 to 8 weeks, including complete prototype validation.
Complement your server deployment with high-capacity storage arrays, high-speed network interfaces, and high-performance system memory.
